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lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 lmh6321 300 ma high speed buffer with adjustable current limit check for samples: lmh6321 1 features description the lmh6321 is a high speed unity gain buffer that 2 ? high slew rate 1800 v/ s slews at 1800 v/ s and has a small signal bandwidth ? wide bandwidth 110 mhz of 110 mhz while driving a 50 ? load. it can drive ? continuous output current 300 ma 300 ma continuously and will not oscillate while driving large capacitive loads. ? output current limit tolerance 5 ma 5% ? wide supply voltage range 5v to 15v the lmh6321 features an adjustable current limit. the current limit is continuously adjustable from 10 ? wide temperature range ? 40 c to +125 c ma to 300 ma with a 5 ma 5% accuracy. the ? adjustable current limit current limit is set by adjusting an external reference ? high capacitive load drive current with a resistor. the current can be easily and instantly adjusted, as needed by connecting the ? thermal shutdown error flag resistor to a dac to form the reference current. the sourcing and sinking currents share the same current applications limit. ? line driver the lmh6321 is available in a space saving 8-pin so ? pin driver powerpad or a 7-pin ddpak power package. the ? sonar driver so powerpad package features an exposed pad on the bottom of the package to increase its heat sinking ? motor control capability. the lmh6321 can be used within the feedback loop of an operational amplifier to boost the current output or as a stand alone buffer. connection diagram a. v ? pin is connected to tab on back of each package. figure 1. 8-pin so powerpad figure 2. 7-pin ddpak (a) 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2006 ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. g = 1 1 2 3 4 5 6 7 v in gnd v out v + v - ef cl v + 1 2 3 4 5 6 7 8 ef cl v in v - v out gnd nc g = 1
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. absolute maximum ratings (1) (2) esd tolerance (3) human body model 2.5 kv machine model 250v supply voltage 36v ( 18v) input to output voltage (4) 5v input voltage v supply output short-circuit to gnd (5) continuous storage temperature range ? 65 c to +150 c junction temperature (t jmax ) +150 c lead temperature (soldering, 10 seconds) 260 c power dissipation (6) c l pin to gnd voltage 1.2v (1) absolute maximum ratings indicate limits beyond which damage to the device may occur. operating ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. for specifications and the test conditions, see the electrical characteristics table. (2) if military/aerospace specified devices are required, please contact the texas instruments sales office/ distributors for availability and specifications. (3) human body model is 1.5 k ? in series with 100 pf. machine model is 0 ? in series with 200 pf. (4) if the input-output voltage differential exceeds 5v, internal clamping diodes will turn on. the current through these diodes should be limited to 5 ma max. thus for an input voltage of 15v and the output shorted to ground, a minimum of 2 k ? should be placed in series with the input. (5) the maximum continuous current must be limited to 300ma. see application hints for more details. (6) the maximum power dissipation is a function of t j(max) , ja , and t a . the maximum allowable power dissipation at any ambient temperature is p d = t j(max) ? t a )/ ja . see thermal management of application hints . operating ratings operating temperature range ? 40 c to +125 c operating supply range 5v to 16v thermal resistance ( ja ) so powerpad package (1) 180 c/w thermal resistance ( jc ) ddpak package 4 c/w thermal resistance ( ja ) 80 c/w (1) soldered to pc board with copper foot print equal to dap size. natural convection (no air flow). board material is fr-4. 2 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 15v electrical characteristics the following specifications apply for supply voltage = 15v, v cm = 0, r l 100 k and r s = 50 , c l open, unless otherwise noted. boldface limits apply for t a = t j = t min to t max ; all other limits t a = t j = 25 c. symbol parameter conditions min typ max units a v voltage gain r l = 1 k , v in = 10v 0.99 0.995 v/v 0.98 r l = 50 , v in = 10v 0.86 0.92 v/v 0.84 v os input offset voltage r l = 1 k , r s = 0v 4 35 mv 52 i b input bias current v in = 0v, r l = 1 k , r s = 0v 2 15 a 17 r. in input resistance r. l = 50 250 k c in input capacitance 3.5 pf r o output resistance i o = 10 ma 5 i s power supply current r l = , v in = 0 11 14.5 16.5 ma 750 a into 14.9 18.5 c l pin 20.5 v o 1 positive output swing i o = 300 ma, r s = 0v, v in = v s 11.2 11.9 10.8 v negative output swing i o = 300 ma, r s = 0v, v in = v s ? 11.3 ? 10.3 ? 9.8 v o 2 positive output swing r l = 1 k ? , r s = 0v, v in = v s 13.1 13.4 12.9 v negative output swing r l = 1 k ? , r s = 0v, v in = v s ? 13.4 ? 12.9 ? 12.6 v o 3 positive output swing r l = 50 ? , r s = 0v, v in = v s 11.6 12.2 11.2 v negative output swing r l = 50 ? , r s = 0v, v in = v s ? 11.9 ? 10.9 ? 10.6 v ef error flag output voltage r l = , v in = 0, normal 5.00 ef pulled up with 5 k ? during 0.25 v to +5v thermal shutdown t sh thermal shutdown temperature measure quantity is die (junction) 168 temperature c hysteresis 10 i sh supply current at thermal ef pulled up with 5 k ? to +5v 3 ma shutdown pssr power supply rejection ratio r l = 1 k ? , v in = 0v, positive 58 66 v s = 5v to 15v 54 db negative 58 64 54 sr slew rate v in = 11v, r l = 1 k 2900 v/ s v in = 11v, r l = 50 1800 bw ? 3 db bandwidth v in = 20 mv pp , r l = 50 110 mhz lsbw large signal bandwidth v in = 2 v pp , r l = 50 48 mhz hd2 2 nd harmonic distortion v o = 2 v pp , f = 100 khz r l = 50 ? ? 59 r l = 100 ? ? 70 dbc v o = 2 v pp , f = 1 mhz r l = 50 ? ? 57 r l = 100 ? ? 68 copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 3 product folder links: lmh6321
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com 15v electrical characteristics (continued) the following specifications apply for supply voltage = 15v, v cm = 0, r l 100 k and r s = 50 , c l open, unless otherwise noted. boldface limits apply for t a = t j = t min to t max ; all other limits t a = t j = 25 c. symbol parameter conditions min typ max units hd3 3rd harmonic distortion v o = 2 v pp , f = 100 khz r l = 50 ? ? 59 r l = 100 ? ? 70 dbc v o = 2 v pp , f = 1 mhz r l = 50 ? ? 62 r l = 100 ? ? 73 e n input voltage noise f 10 khz 2.8 nv/ hz i n input current noise f 10 khz 2.4 pa/ hz i sc 1 output short circuit current v o = 0v, sourcing 4.5 10 15.5 source (1) program current v in = +3v 4.5 15.5 ma into c l = 25 a sinking 4.5 10 15.5 v in = ? 3v 4.5 15.5 v o = 0v sourcing 280 295 308 program current v in = +3v 273 325 ma into c l = 750 a sinking 280 295 310 v in = ? 3v 275 325 i sc 2 output short circuit current r s = 0v, v in = +3v (1) (2) 320 570 750 source 300 920 ma output short circuit current sink r s = 0v, v in = ? 3v (1) (2) 300 515 750 305 910 v/i section clv os current limit input offset voltage r l = 1 k ? , gnd = 0v 0.5 4.0 mv 8.0 cli b current limit input bias current r l = 1 k ? ? 0.5 ? 0.2 a ? 0.8 cl current limit common mode r l = 1 k ? , gnd = ? 13 to +14v 60 69 db cmrr rejection ratio 56 (1) v in = + or ? 4v at t j = ? 40 c. (2) for the condition where the c l pin is left open the output current should not be continuous, but instead, should be limited to low duty cycle pulse mode such that the rms output current is less than or equal to 300 ma. 4 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 5v electrical characteristics the following specifications apply for supply voltage = 5v, v cm = 0, r l 100 k and r s = 50 , c l open, unless otherwise noted. boldface limits apply for t a = t j = t min to t max ; all other limits t a = t j = 25 c. symbol parameter conditions min typ max units a v voltage gain r l = 1 k , v in = 3v 0.99 0.994 0.98 v/v r l = 50 , v in = 3v 0.86 0.92 0.84 v os offset voltage r l = 1 k , r s = 0v 2.5 35 mv 50 i b input bias current v in = 0v, r l = 1 k , r s = 0v 2 15 a 17 r in input resistance r l = 50 250 k c in input capacitance 3.5 pf r o output resistance i out = 10 ma 5 i s power supply current r l = , v in = 0v 10 13.5 ma 14.7 750 a into cl pin 14 17.5 19.5 v o 1 positive output swing i o = 300 ma, r s = 0v, v in = v s 1.3 1.9 0.9 v negative output swing i o = 300 ma, r s = 0v, v in = v s ? 1.3 ? 0.5 ? 0.1 v o 2 positive output swing r l = 1 k , r s = 0v, v in = v s 3.2 3.5 v 2.9 negative output swing r l = 1 k , r s = 0v, v in = v s ? 3.5 ? 3.1 v ? 2.9 v o 3 positive output swing r l = 50 , r s = 0v, v in = v s 2.8 3.1 v 2.5 negative output swing r l = 50 , r s = 0v, v in = v s ? 3.0 ? 2.6 v ? 2.4 pssr power supply rejection ratio r l = 1 k ? , v in = 0, positive 58 66 v s = 5v to 15v 54 db negative 58 64 54 i sc 1 output short circuit current v o = 0v, program current sourcing 4.5 9 14.0 into c l = 25 a v in = +3v 4.5 15.5 sinking 4.5 9 14.0 v in = ? 3v 4.5 15.5 ma v o = 0v, program current sourcing 275 290 305 into c l = 750 a v in = +3v 270 320 sinking 275 290 310 v in = ? 3v 270 320 i sc 2 output short circuit current r s = 0v, v in = +3v (1) (2) 300 470 source ma output short circuit current sink r s = 0v, v in = ? 3v (1) (2) 300 400 sr slew rate v in = 2 v pp , r l = 1 k 450 v/ s v in = 2 v pp , r l = 50 210 bw ? 3 db bandwidth v in = 20 mv pp , r l = 50 ? 90 mhz lsbw large signal bandwidth v in = 2 v pp , r l = 50 ? 39 mhz t sd thermal shutdown temperature 170 c hysteresis 10 v/i section (1) for the condition where the c l pin is left open the output current should not be continuous, but instead, should be limited to low duty cycle pulse mode such that the rms output current is less than or equal to 300 ma. (2) v in = + or ? 4v at t j = ? 40 c. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 5 product folder links: lmh6321
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com 5v electrical characteristics (continued) the following specifications apply for supply voltage = 5v, v cm = 0, r l 100 k and r s = 50 , c l open, unless otherwise noted. boldface limits apply for t a = t j = t min to t max ; all other limits t a = t j = 25 c. symbol parameter conditions min typ max units clv os current limit input offset r l = 1 k ? , gnd = 0v 2.7 +5 mv voltage 5.0 cli b current limit input bias current r l = 1 k ? , c l = 0v ? 0.5 ? 0.2 a ? 0.6 cl current limit common mode r l = 1 k ? , gnd = ? 3v to +4v 60 65 db cmrr rejection ratio 56 6 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 typical performance characteristics overshoot vs. capacitive load slew rate figure 3. figure 4. slew rate small signal step response figure 5. figure 6. input offset voltage of amplifier vs. small signal step response supply voltage figure 7. figure 8. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 7 product folder links: lmh6321 10 100 1k 10k c l (pf) 0 10 20 30 40 50 60 overshoot (%) undershoot overshoot v in = 100 mv pp r l = open v s = 15v time (10 ns/div) (100 mv/div) input signal output signal v in = 200 mv pp r l = 1 k : v s = 15v time (10 ns/div) (100 mv/div) input signal output signal v in = 200 mv pp r l = 1 k : v s = 5v 3 5 7 9 11 13 15 supply voltage (v) 6 7 8 9 10 input offset voltage (mv) 125c 85c 25c -40c 0 4 8 12 16 20 200 600 1000 1400 1800 2200 2600 3000 slew rate (v/ p s) supply voltage (v) r l = 50 : r l = 1 k : 0 4 8 12 16 20 24 200 3000 slew rate (v/ p s) input amplitude (v pp ) 600 1000 1400 1800 2200 2600 v s = 15v r l = 1 k : r l = 50 :
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com typical performance characteristics (continued) small signal step response small signal step response figure 9. figure 10. large signal step response ? leading edge large signal step response ? leading edge figure 11. figure 12. large signal step response ? trailing edge large signal step response ? trailing edge figure 13. figure 14. 8 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 time (10 ns/div) (100 mv/div) input signal output signal v in = 200 mv pp r l = 50 : v s = 15v time (5 ns/div) ( 5 v/div) v in = 20 v pp r l = 50 : v s = 15v input signal output signal time (10 ns/div) (100 mv/div) input signal output signal v in = 200 mv pp r l = 50 : v s = 5v time (5 ns/div) ( 5 v/div) v in = 20 v pp r l = 50 : v s = 15v input signal output signal time (5 ns/div) ( 5 v/div) v in = 20 v pp r l = 1 k : v s = 15v input signal output signal time (5 ns/div) ( 5 v/div) v in = 20 v pp r l = 1 k : v s = 15v input signal output signal
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 typical performance characteristics (continued) large signal step response large signal step response figure 15. figure 16. large signal step response large signal step response figure 17. figure 18. harmonic distortion with 50 ? load harmonic distortion with 100 ? load figure 19. figure 20. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 9 product folder links: lmh6321 0 5 10 15 20 25 30 output amplitude (v pp ) -80 -70 -60 -50 -40 -30 -20 hd2 and hd3 (dbc) v s = 15v f = 1 mhz hd3 hd2 v out (2v/div) time (20 ns/div) r l = 50 : v s = 15v v out (0.5v/div) time (20 ns/div) r l = 1 k : v s = 5v v out (2v/div) time (20 ns/div) r l = 1 k : v s = 15v v out (0.5v/div) time (20 ns/div) r l = 50 : v s = 5v 0 5 10 15 20 25 30 output amplitude (v pp ) -80 -70 -60 -50 -40 -30 -20 hd2 and hd3 (dbc) hd2 hd3 v s = 15v f = 1 mhz
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com typical performance characteristics (continued) noise vs. harmonic distortion with 50 ? load frequency figure 21. figure 22. gain gain vs. vs. frequency frequency figure 23. figure 24. gain gain vs. vs. frequency frequency figure 25. figure 26. 10 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 0 5 10 15 20 25 -70 -65 -60 -55 -50 -45 -40 -35 -30 hd2 & hd3 (dbc) output voltage (v) v s = 15v r l = 50 : f = 100 khz hd2 hd3 100k 1m 10m 100m 1g frequency (hz) -20 -15 -10 -5 0 5 gain (db) v s = 5v r l = 1 k : 100k 1m 10m 100m 1g frequency (hz) -20 -15 -10 -5 0 5 gain (db) v s = 15v r l = 1 k : 100k 1m 10m 100m 1g frequency (hz) -25 -20 -15 -10 -5 0 5 gain (db) v s = 15v r l = 50 : 100k 1m 10m 100m 1g frequency (hz) -25 -20 -15 -10 -5 0 5 gain (db) v s = 5v r l = 50 : 1.0 10 100 1k 100k frequency (hz) 0.1 1.0 1000 10000 noise 10k 10 100 voltage nv/ hz) current pa/ hz)
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 typical performance characteristics (continued) supply current output impedance vs. vs. supply voltage sourcing current figure 27. figure 28. output impedance output impedance vs. vs. sinking current sourcing current figure 29. figure 30. output impedance vs. output short circuit current ? sourcing vs. sinking current program current figure 31. figure 32. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 11 product folder links: lmh6321 5 7 9 11 13 15 17 19 sinking current (ma) 4.2 4.4 4.6 4.8 5 5.2 output impedance ( : ) -40c v s = 15v 125c 25c 85c 25 125 225 325 425 525 625 725 825 program current ( p a) 0 100 200 300 400 output current (ma) 125c -40c 25c 85c v s = 15v 5 7 9 11 13 15 17 19 sinking current (ma) 4.6 4.8 5 5.2 5.4 5.6 output impedance ( : ) -40c v s = 5v 125c 25c 85c 5 7 9 11 13 15 17 19 sourcing current (ma) 4 4.2 4.4 4.6 4.8 5 output impedance ( : ) -40c v s = 15v 125c 25c 85c 5 7 9 11 13 15 17 19 sourcing current (ma) 4.2 4.4 4.6 4.8 5 5.2 output impedance ( : ) -40c 125c 25c 85c v s = 5v 1 3 5 7 9 11 13 15 17 19 0 2 4 6 8 10 14 supply current (ma) supply voltage (v) 12 125c 25c -40c 85c
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com typical performance characteristics (continued) output short circuit current ? sinking vs. output short circuit current ? sourcing vs. program current program current figure 33. figure 34. positive output swing output short circuit current ? sinking vs. vs. program current sourcing current figure 35. figure 36. negative output swing positive output swing vs. vs. sinking current sourcing current figure 37. figure 38. 12 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 25 125 225 325 425 525 625 725 825 program current ( p a) 0 100 200 300 400 output current (ma) 125c -40c 25c 85c v s = 15v 25 125 225 325 425 525 625 725 825 program current ( p a) 0 100 200 300 400 output current (ma) 125c -40c 25c 85c v s = 5v 25 125 225 325 425 525 625 725 825 program current ( p a) 0 100 200 300 400 output current (ma) 125c -40c 25c 85c v s = 5v 0 100 200 300 400 500 0 0.5 1 1.5 2 2.5 3 3.5 4 output swing (v) sourcing current (ma) 125c 85c 25c -40c v s = 5v v in = v + c l = open 0 100 200 300 400 500 9 10 11 12 13 14 output swing (v) sourcing current (ma) 125c 85c 25c -40c v s = 15v v in = v + c l = open -500 -400 -300 -200 -100 0 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 output swing (v) sinking current (ma) 125c 85c 25c -40c v s = 5v v in = v - c l = open
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 typical performance characteristics (continued) negative output swing vs. output short circuit current ? sourcing vs. sinking current supply voltage figure 39. figure 40. positive output swing output short circuit current ? sinking vs. vs. supply voltage supply voltage figure 41. figure 42. positive output swing negative output swing vs. vs. supply voltage supply voltage figure 43. figure 44. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 13 product folder links: lmh6321 2 4 6 8 10 12 14 16 18 supply voltage (v) 0 200 400 600 800 output current (ma) -40c -40c 25c 85c 125c v in = - 3v c l = open 5 7 9 11 13 15 3 5 7 9 11 13 15 output swing (v) supply voltage (v) r l = 50 : 125c 85c 25c -40c 5 7 9 11 13 15 3 5 7 9 11 13 15 output swing (v) supply voltage (v) r l = 1 k : 125c 85c 25c -40c 5 7 9 11 13 15 -15 -13 -11 -9 -7 -5 -3 output swing (v) supply voltage (v) r l = 50 : 125c 85c -40c 25c 2 4 6 8 10 12 14 16 18 supply voltage (v) 0 200 400 600 800 1000 output current (ma) -40c 25c 85c 125c v in = +3 c l = open -500 -400 -300 -200 -100 0 -14 -13 -12 -11 -10 -9 output swing (v) sinking current (ma) 125c 85c 25c -40c v s = 15v v in = v - c l = open
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com typical performance characteristics (continued) negative output swing input offset voltage of amplifier vs. vs. supply voltage common mode voltage figure 45. figure 46. input bias current of amplifier input offset voltage of amplifier vs. vs. common mode voltage supply voltage figure 47. figure 48. input offset voltage of v/i section vs. input offset voltage of v/i section vs. common mode voltage common mode voltage figure 49. figure 50. 14 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 5 7 9 11 13 15 -15 -13 -11 -9 -7 -5 -3 output swing (v) supply voltage (v) r l = 1 k : 85c 25c -40c 125c input offset voltage (mv) -12 -8 -4 0 4 12 common mode voltage (v) -10 -8 -6 -4 -2 0 2 8 4 v s = 15v -40c 85c 125c 25c -12 -8 -4 0 4 8 12 common mode voltage (v) -25 -15 -5 5 15 25 input offset voltge (mv) v s = 15v 125c 85c -40c 25c -40c 125c -40c 85c 125c 3 5 7 9 11 13 15 supply voltage (v) -10 -8 -6 -4 -2 0 input bias current ( p a) 25c -3 -2 -1 1 2 common mode voltage (v) -5 0 5 10 15 input offset voltage (mv) 0 3 -40c 25c 85c 125c v s = 5v -40c input offset voltage (mv) -3 -2 -1 0 1 3 common mode voltage (v) -2 -1 0 1 2 3 4 2 5 v s = 5v 25c 85c -40c
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 application hints buffers buffers are often called voltage followers because they have largely unity voltage gain, thus the name has generally come to mean a device that supplies current gain but no voltage gain. buffers serve in applications requiring isolation of source and load, i.e., high input impedance, low output impedance (high output current drive). in addition, they offer gain flatness and wide bandwidth. most operational amplifiers, that meet the other given requirements in a particular application, can be configured as buffers, though they are generally more complex and are, by and large, not optimized for unity gain operation. the commercial buffer is a cost effective substitute for an op amp. buffers serve several useful functions, either in tandem with op amps or in standalone applications. as mentioned, their primary function is to isolate a high impedance source from a low impedance load, since a high z source can ? t supply the needed current to the load. for example, in the case where the signal source to an analog to digital converter is a sensor, it is recommended that the sensor be isolated from the a/d converter. the use of a buffer ensures a low output impedance and delivery of a stable output to the converter. in a/d converter applications buffers need to drive varying and complex reactive loads. buffers come in two flavors: open loop and closed loop. while sacrificing the precision of some dc characteristics, and generally displaying poorer gain linearity, open loop buffers offer lower cost and increased bandwidth, along with less phase shift and propagation delay than do closed loop buffers. the lmh6321 is of the open loop variety. figure 51 shows a simplified diagram of the lmh6321 topology, revealing the open loop complementary follower design approach. figure 52 shows the lmh6321 in a typical application, in this case, a 50 ? coaxial cable driver. figure 51. simplified schematic supply bypassing the method of supply bypassing is not critical for frequency stability of the buffer, and, for light loads, capacitor values in the neighborhood of 1 nf to 10 nf are adequate. however, under fast slewing and large loads, large transient currents are demanded of the power supplies, and when combined with any significant wiring inductance, these currents can produce voltage transients. for example, the lmh6321 can slew typically at 1000 v/ s. therefore, under a 50 ? load condition the load can demand current at a rate, di/dt, of 20 a/ s. this current flowing in an inductance of 50 nh (approximately 1.5 ? of 22 gage wire) will produce a 1v transient. thus, it is recommended that solid tantalum capacitors of 5 f to 10 f, in parallel with a ceramic 0.1 f capacitor be added as close as possible to the device supply pins. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 15 product folder links: lmh6321 v out v in v + v - q6 r 2 q2 q1 r 1 q5 q7 r 3 2 : r 4 2 : q4 q8 d2 d4 d6 d8d10 d12 d1 d3 d5 d7 d9 d11 q3
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com figure 52. 50 ? coaxial cable driver with dual supplies for values of capacitors in the 10 f to 100 f range, ceramics are usually larger and more costly than tantalums but give superior ac performance for bypassing high frequency noise because of their very low esr (typically less than 10 m ? ) and low esl. load impedance the lmh6321 is stable under any capacitive load when driven by a 50 ? source. as shown by figure 3 in typical performance characteristics , worst case overshoot is for a purely capacitive load of about 1 nf. shunting the load capacitance with a resistor will reduce the overshoot. source inductance like any high frequency buffer, the lmh6321 can oscillate with high values of source inductance. the worst case condition occurs with no input resistor, and a purely capacitive load of 50 pf, where up to 100 nh of source inductance can be tolerated. with a 50 ? load, this goes up to 200 nh. however, a 100 ? resistor placed in series with the buffer input will ensure stability with a source inductances up to 400 nh with any load. overvoltage protection (refer to the simplified schematic in figure 51 ). if the input-to-output differential voltage were allowed to exceed the absolute maximum rating of 5v, an internal diode clamp would turn on and divert the current around the compound emitter followers of q1/q3 (d1 ? d11 for positive input), or around q2/q4 (d2 ? d12 for negative inputs). without this clamp, the input transistors q1 ? q4 would zener, thereby damaging the buffer. to limit the current through this clamp, a series resistor should be added to the buffer input (see r 1 in figure 52 ). although the allowed current in the clamp can be as high as 5 ma, which would suggest a 2 k ? resistor from a 15v source, it is recommended that the current be limited to about 1 ma, hence the 10 k ? shown. the reason for this larger resistor is explained in the following: one way that the input/output voltage differential can exceed the abs max value is under a short circuit condition to ground while driving the input with up to 15v. however, in the lmh6321 the maximum output current is set by the programmable current limit pin (c l ). the value set by this pin is specified to be accurate to 5 ma 5%. if the input/output differential exceeds 5v while the output is trying to supply the maximum set current to a shorted condition or to a very low resistance load, a portion of that current will flow through the clamp diodes, thus creating an error in the total load current. if the input resistor is too low, the error current can exceed the 5 ma 5% budget. 16 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 | r 1 10 k : input c 1 1 nf c in c 3 0.1 p f r 4 50 : 50 : coaxial cable r 6 50 : output r 3 10 k : 1% v cl tp1 ef v + c 2 0.1 p f r 2 10 k : 1% v - gnd c l lmh6321 ef v + v - v out v in
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 bandwidth and stability as can be seen in the schematic of figure 52 , a small capacitor is inserted in parallel with the series input resistors. the reason for this is to compensate for the natural band-limiting effect of the 1st order filter formed by this resistor and the input capacitance of the buffer. with a typical c in of 3.5 pf ( figure 52 ), a pole is created at fp2 = 1/(2 r 1 c in ) = 4.5 mhz (1) this will band-limit the buffer and produce further phase lag. if used in an op amp-loop application with an amplifier that has the same order of magnitude of unity gain crossing as fp2, this additional phase lag will produce oscillation. the solution is to add a small feed-forward capacitor (phase lead) around the input resistor, as shown in figure 52 . the value of this capacitor is not critical but should be such that the time constant formed by it and the input resistor that it is in parallel with (r in ) be at least five times the time constant of r in c in . therefore, c 1 = (5r in /r 1 )(c in ) (2) from electrical characteristics , r in is 250 k ? . in the case of the example in figure 52 , r in c in produces a time-constant of 870 ns, so c 1 should be chosen to be a minimum of 4.4 s, or 438 pf. the value of c 1 (1000 pf) shown in figure 52 gives 10 s. output current and short circuit protection the lmh6321 is designed to deliver a maximum continuous output current of 300 ma. however, the maximum available current, set by internal circuitry, is about 700 ma at room temperature. the output current is programmable up to 300 ma by a single external resistor and voltage source. the lmh6321 is not designed to safely output 700 ma continuously and should not be used this way. however, the available maximum continuous current will likely be limited by the particular application and by the package type chosen, which together set the thermal conditions for the buffer (see thermal management ) and could require less than 300 ma. the programming of both the sourcing and sinking currents into the load is accomplished with a single resistor. figure 53 shows a simplified diagram of the v to i converter and i sc protection circuitry that, together, perform this task. referring to figure 53 , the two simplified functional blocks, labeled v/i converter and short circuit protection, comprise the circuitry of the current limit control. the v/i converter consists of error amplifier a1 driving two pnp transistors in a darlington configuration. the two input connections to this amplifier are v cl (inverting input) and gnd (non-inverting input). if gnd is connected to zero volts, then the high open loop gain of a1, as well as the feedback through the darlington, will force c l , and thus one end r ext to be at zero volts also. therefore, a voltage applied to the other end of r ext will force a current i ext = v prog /r ext (3) into this pin. via this pin, i out is programmable from 10 ma to 300 ma by setting i ext from 25 a to 750 a by means of a fixed r ext of 10 k ? and making v cl variable from 0.25v to 7.5v. thus, an input voltage v cl is converted to a current i ext . this current is the output from the v/i converter. it is gained up by a factor of two and sent to the short circuit protection block as i prog . i prog sets a voltage drop across r sc which is applied to the non-inverting input of error amp a2. the other input is across r sense . the current through r sense , and hence the voltage drop across it, is proportional to the load current, via the current sense transistor q sense . the output of a2 controls the drive (i drive ) to the base of the npn output transistor, q3 which is, proportional to the amount and polarity of the voltage differential (v diff ) between amp2 inputs, that is, how much the voltage across r sense is greater than or less than the voltage across r sc . this loop gains i ext up by another 200, thus i sc = 2 x 200 (i ext ) = 400 i ext (4) therefore, combining equation 3 and equation 4 , and solving for r ext , we get r ext = 400 v prog /i sc (5) if the v cl pin is left open, the output short circuit current will default to about 700 ma. at elevated temperatures this current will decrease. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 17 product folder links: lmh6321
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com only the npn output i sc protection is shown. depending on the polarity of v diff , amp2 will turn i drive either on or off. figure 53. simplified diagram of current limit control thermal management heatsinking for some applications, a heat sink may be required with the lmh6321. this depends on the maximum power dissipation and maximum ambient temperature of the application. to accomplish heat sinking, the tabs on ddpak and so powerpad package may be soldered to the copper plane of a pcb for heatsinking (note that these tabs are electrically connected to the most negative point in the circuit, i. e.,v ? ). heat escapes from the device in all directions, mainly through the mechanisms of convection to the air above it and conduction to the circuit board below it and then from the board to the air. natural convection depends on the amount of surface area that is in contact with the air. if a conductive plate serving as a heatsink is thick enough to ensure perfect thermal conduction (heat spreading) into the far recesses of the plate, the temperature rise would be simply inversely proportional to the total exposed area. pcb copper planes are, in that sense, an aid to convection, the difference being that they are not thick enough to ensure perfect conduction. therefore, eventually we will reach a point of diminishing returns (as seen in figure 55 ). very large increases in the copper area will produce smaller and smaller improvement in thermal resistance. this occurs, roughly, for a 1 inch square of 1 oz copper board. some improvement continues until about 3 square inches, especially for 2 oz boards and better, but beyond that, external heatsinks are required. ultimately, a reasonable practical value attainable for the junction to ambient thermal resistance is about 30 c/w under zero air flow. a copper plane of appropriate size may be placed directly beneath the tab or on the other side of the board. if the conductive plane is placed on the back side of the pcb, it is recommended that thermal vias be used per jedec standard jesd51-5. 18 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 + - v/i converter | + - short circuit protection i ext 25 p a to 750 p a gnd v cl a1 npn output xtr i drive v + to input stage r 3 2 : v + amp2 q sense r sense 200 : to lower output stage output v diff r sc 400 : i out sense xtr i sense i load i prog 50 p a to 1.5 ma r external v prog connect to ground (for dual supplies) or mid rail for single supply
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 determining copper area one can determine the required copper area by following a few basic guidelines: 1. determine the value of the circuit ? s power dissipation, p d 2. specify a maximum operating ambient temperature, t a(max) . note that when specifying this parameter, it must be kept in mind that, because of internal temperature rise due to power dissipation, the die temperature, t j , will be higher than t a by an amount that is dependent on the thermal resistance from junction to ambient, ja . therefore, t a must be specified such that t j does not exceed the absolute maximum die temperature of 150 c. 3. specify a maximum allowable junction temperature, t j(max) , which is the temperature of the chip at maximum operating current. although no strict rules exist, typically one should design for a maximum continuous junction temperature of 100 c to 130 c, but no higher than 150 c which is the absolute maximum rating for the part. 4. calculate the value of junction to ambient thermal resistance, ja 5. choose a copper area that will ensure the specified t j(max) for the calculated ja . ja as a function of copper area in square inches is shown in figure 54 . the maximum value of thermal resistance, junction to ambient ja , is defined as: ja = (t j(max) - t a(max) )/ p d(max) where ? t j(max) = the maximum recommended junction temperature ? t a(max) = the maximum ambient temperature in the user ? s environment ? p d(max) = the maximum recommended power dissipation (6) note the allowable thermal resistance is determined by the maximum allowable heat rise , t rise = t j(max) - t a(max) = ( ja ) (p d(max) ). thus, if ambient temperature extremes force t rise to exceed the design maximum, the part must be de-rated by either decreasing p d to a safe level, reducing ja , further, or, if available, using a larger copper area. procedure 1. first determine the maximum power dissipated by the buffer, p d(max) . for the simple case of the buffer driving a resistive load, and assuming equal supplies, p d(max) is given by: p d(max) = i s (2v + ) + v +2 /4r l where ? i s = quiescent supply current (7) 2. determine the maximum allowable die temperature rise, t r(max) = t j(max) -t a(max) = p d(max) ja (8) 3. using the calculated value of t r(max) and p d(max) the required value for junction to ambient thermal resistance can be found: ja = t r(max) /p d(max) (9) 4. finally, using this value for ja choose the minimum value of copper area from figure 54 . example assume the following conditions: v + = v ? = 15v, r l = 50 ? , i s = 15 ma t j(max) = 125 c, t a(max) = 85 c. 1. from equation 7 ? p d(max) = i s (2v + ) + v +2 /4r l = (15 ma)(30v) + 15v 2 /200 ? = 1.58w 2. from equation 8 ? t r(max) = 125 c - 85 c = 40 c 3. from equation 9 ? ja = 40 c/1.58w = 25.3 c/w copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 19 product folder links: lmh6321
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com examining figure 54 , we see that we cannot attain this low of a thermal resistance for one layer of 1 oz copper. it will be necessary to derate the part by decreasing either the ambient temperature or the power dissipation. other solutions are to use two layers of 1 oz foil, or use 2 oz copper (see table 1 ), or to provide forced air flow. one should allow about an extra 15% heat sinking capability for safety margin. figure 54. thermal resistance (typ) for 7-l ddpak package mounted on 1 oz. (0.036 mm) pc board foil figure 55. derating curve for ddpak package. no air flow table 1. ja vs. copper area and p d for ddpak. 1.0 oz cu board. no air flow. ambient temperature = 24 c copper area ja @ 1.0w ja @ 2.0w ( c/w) ( c/w) 1 layer = 1 ? x2 ? cu bottom 62.4 54.7 2 layer = 1 ? x2 ? cu top & bottom 36.4 32.1 2 layer = 2 ? x2 ? cu top & bottom 23.5 22.0 2 layer = 2 ? x4 ? cu top & bottom 19.8 17.2 20 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 0 1 2 3 copper foil area (sq. in.) 20 30 40 50 60 70 80 thermal resistance t ja (c/w) -40 -25 25 75 125 max power dissipation (w) ambient temperature (c) 0 1 2 3 4 5 to-263 package pcb mount 1 sq. in. copper
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 as seen in the previous example, buffer dissipation in dc circuit applications is easily computed. however, in ac circuits, signal wave shapes and the nature of the load (reactive, non-reactive) determine dissipation. peak dissipation can be several times the average with reactive loads. it is particularly important to determine dissipation when driving large load capacitance. a selection of thermal data for the so powerpad package is shown in table 2 . the table summarizes ja for both 0.5 watts and 0.75 watts. note that the thermal resistance, for both the ddpak and the so powerpad package is lower for the higher power dissipation levels. this phenomenon is a result of the principle of newtons law of cooling. restated in term of heatsink cooling, this principle says that the rate of cooling and hence the thermal conduction, is proportional to the temperature difference between the junction and the outside environment (ambient). this difference increases with increasing power levels, thereby producing higher die temperatures with more rapid cooling. table 2. ja vs. copper area and p d for so powerpad. 1.0 oz cu board. no airflow. ambient temperature = 22 c copper area/vias ja @ 0.5w ja @ 0.75w ( c/w) ( c/w) 1 layer = 0.05 sq. in. (bottom) + 3 via pads 141.4 138.2 1 layer = 0.1 sq. in. (bottom) + 3 via pads 134.4 131.2 1 layer = 0.25 sq. in. (bottom) + 3 via pads 115.4 113.9 1 layer = 0.5 sq. in. (bottom) + 3 via pads 105.4 104.7 1 layer = 1.0 sq. in. (bottom) + 3 via pads 100.5 100.2 2 layer = 0.5 sq. in. (top)/ 0.5 sq. in. (bottom) + 33 93.7 92.5 via pads 2 layer = 1.0 sq. in. (top)/ 1.0 sq. in. (bottom) + 53 82.7 82.2 via pads error flag operation the lmh6321 provides an open collector output at the ef pin that produces a low voltage when the thermal shutdown protection is engaged, due to a fault condition. under normal operation, the error flag pin is pulled up to v + by an external resistor. when a fault occurs, the ef pin drops to a low voltage and then returns to v + when the fault disappears. this voltage change can be used as a diagnostic signal to alert a microprocessor of a system fault condition. if the function is not used, the ef pin can be either tied to ground or left open. if this function is used, a 10 k ? , or larger, pull-up resistor (r 2 in figure 52 ) is recommended. the larger the resistor the lower the voltage will be at this pin under thermal shutdown. table 3 shows some typical values of v ef for 10 k ? and 100 k ? . table 3. v ef vs. r 2 r 2 ( in figure 52 ) @ v + = 5v @v + = 15v 10 k ? 0.24v 0.55v 100 k ? 0.036v 0.072v single supply operation if dual supplies are used, then the gnd pin can be connected to a hard ground (0v) (as shown in figure 52 ). however, if only a single supply is used, this pin must be set to a voltage of one v be ( 0.7v) or greater, or more commonly, mid rail, by a stiff, low impedance source. this precludes applying a resistive voltage divider to the gnd pin for this purpose. figure 56 shows one way that this can be done. copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 21 product folder links: lmh6321
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com figure 56. using an op amp to bias the gnd pin to ? v + for single supply operation in figure 56 , the op amp circuit pre-biases the gnd pin of the buffer for single supply operation. the gnd pin can be driven by an op amp configured as a constant voltage source, with the output voltage set by the resistor voltage divider, r 1 and r 2 . it is recommended that these resistors be chosen so as to set the gnd pin to v + /2, for maximum common mode range. slew rate slew rate is the rate of change of output voltage for large-signal step input changes. for resistive load, slew rate is limited by internal circuit capacitance and operating current (in general, the higher the operating current for a given internal capacitance, the faster is the slew rate). figure 57 shows the slew capabilities of the lmh6321 under large signal input conditions, using a resistive load. figure 57. slew rate vs. peak-to-peak input voltage however, when driving capacitive loads, the slew rate may be limited by the available peak output current according to the following expression. dv/dt = i pk /c l (10) 22 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321 lmh6321 gnd v + v - v + op amp r 1 r 2 - + 0 4 8 12 16 20 24 200 3000 slew rate (v/ p s) input amplitude (v pp ) 600 1000 1400 1800 2200 2600 v s = 15v r l = 1 k : r l = 50 :
lmh6321 www.ti.com snosal8c ? april 2006 ? revised march 2013 and rapidly changing output voltages will require large output load currents. for example if the part is required to slew at 1000 v/ s with a load capacitance of 1 nf the current demand from the lmh6321 would be 1a. therefore, fast slew rate is incompatible with large c l . also, since c l is in parallel with the load, the peak current available to the load decreases as c l increases. figure 58 illustrates the effect of the load capacitance on slew rate. slew rate tests are specified for resistive loads and/or very small capacitive loads, otherwise the slew rate test would be a measure of the available output current. for the highest slew rate, it is obvious that stray load capacitance should be minimized. peak output current should be kept below 500 ma. this translates to a maximum stray capacitance of 500 pf for a slew rate of 1000 v/ s. figure 58. slew rate vs. load capacitance copyright ? 2006 ? 2013, texas instruments incorporated submit documentation feedback 23 product folder links: lmh6321 0.1 1 10 100 1000 capacitance (nf) 0.1 1 10 1000 10000 slew rate (v/ p s) 100
lmh6321 snosal8c ? april 2006 ? revised march 2013 www.ti.com revision history changes from revision b (march 2013) to revision c page ? changed layout of national data sheet to ti format .......................................................................................................... 23 24 submit documentation feedback copyright ? 2006 ? 2013, texas instruments incorporated product folder links: lmh6321
package option addendum www.ti.com 24-aug-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lmh6321mr lifebuy so powerpad dda 8 95 tbd call ti call ti -40 to 125 lmh63 21mr lmh6321mr/nopb active so powerpad dda 8 95 green (rohs & no sb/br) cu sn level-3-260c-168 hr -40 to 125 lmh63 21mr lmh6321mrx/j7003013 obsolete so powerpad dda 8 tbd call ti call ti lmh63 21mr lmh6321mrx/nopb active so powerpad dda 8 2500 green (rohs & no sb/br) cu sn level-3-260c-168 hr -40 to 125 lmh63 21mr lmh6321ts/nopb active ddpak/ to-263 ktw 7 45 pb-free (rohs exempt) cu sn level-3-245c-168 hr -40 to 125 lmh6321ts lmh6321tsx/nopb active ddpak/ to-263 ktw 7 500 pb-free (rohs exempt) cu sn level-3-245c-168 hr -40 to 125 lmh6321ts (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 24-aug-2018 addendum-page 2 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lmh6321mrx/nopb so power pad dda 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 q1 lmh6321tsx/nopb ddpak/ to-263 ktw 7 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 q2 package materials information www.ti.com 23-sep-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) lmh6321mrx/nopb so powerpad dda 8 2500 367.0 367.0 35.0 lmh6321tsx/nopb ddpak/to-263 ktw 7 500 367.0 367.0 45.0 package materials information www.ti.com 23-sep-2013 pack materials-page 2
generic package view images above are just a representation of the package family, actual package may vary. refer to the product data sheet for package details. dda 8 powerpad tm soic - 1.7 mm max height plastic small outline 4202561/g
mechanical da t a ktw0007b www .ti.com bo t t om side of p a ckage t s 7 b ( r e v e )
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as is ? and with all faults. ti disclaims all other warranties or representations, express or implied, regarding resources or use thereof, including but not limited to accuracy or completeness, title, any epidemic failure warranty and any implied warranties of merchantability, fitness for a particular purpose, and non-infringement of any third party intellectual property rights. ti shall not be liable for and shall not defend or indemnify designer against any claim, including but not limited to any infringement claim that relates to or is based on any combination of products even if described in ti resources or otherwise. in no event shall ti be liable for any actual, direct, special, collateral, indirect, punitive, incidental, consequential or exemplary damages in connection with or arising out of ti resources or use thereof, and regardless of whether ti has been advised of the possibility of such damages. unless ti has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., iso/ts 16949 and iso 26262), ti is not responsible for any failure to meet such industry standard requirements. where ti specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. using products in an application does not by itself establish any safety features in the application. designers must ensure compliance with safety-related requirements and standards applicable to their applications. designer may not use any ti products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). such equipment includes, without limitation, all medical devices identified by the u.s. food and drug administration as class iii devices and equivalent classifications outside the u.s. ti may expressly designate certain products as completing a particular qualification (e.g., q100, military grade, or enhanced product). designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at designers ? own risk. designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. designer will fully indemnify ti and its representatives against any damages, costs, losses, and/or liabilities arising out of designer ? s non- compliance with the terms and provisions of this notice. mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2018, texas instruments incorporated

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